DE600C Electron Beam Evaporation system

The DE600C Electron Beam Evaporation system is assembled with triad e-beam source, it can be used to evaporate metals, semiconductor or insulation materials on the substrate

Features
Description

Features

Evaporation Chamber and Load Lock chamber isolated by gate valve （option）

Evaporation Chamber with front O-ring sealing door for easy inside operation, all other ports are metal sealing

Substrate shutter is Closed Loop controlled to open/close by Thin Film Controller

Optional RF Plasma substrate Cleaning or Ion Gun substrate Cleaning in the Load Lock

Optional substrate oxidation in the Load Lock

System safety Interlock
Total Auto Control or manual operation by computer

Typical Application

For R & D Thin Film Deposition

Ideal tools for LIFT-OFF process

Evaporate metal, Semiconductor or Insulation Materials

Evaporate Magnetic Materials

Configuration

Evaporation Chamber	304 stainless steel chamber of front open door with viewport
Vacuum Pumping	Cryopump or Turbo pump and dry rough pump
Vacuum Valve	Pneumatic valves
Vacuum Gauging	Wide range vacuum gauge and rough gauge
Evaporation Source	Triad e-beam sources
Sample Stage	Top mounted rotary sample stage Side mounted tilt and rotary sample stage (option heating to 600C) (option cooling to -150C)
Film Control	Crystal Film Rate and Thickness Monitor and Control
Load Lock Chamber (Option)	304 stainless steel chamber of front open door with viewport

Specification

The Base Vacuum Pessure

5E-8 Torr

Sample Loading Capacity

One Max. 4 inch flat substrate or many smaller

Film Uniformity

+/-2% on 4” rotating substrate (2000A Ti film)

Rate Resolution

0.1 Angstroms/sec

DE600C Electron Beam Evaporation system

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