DE500 Magnetron Sputter are assembled with four sputter sources for sputtering metals, semiconductor and insulation materials on the substrate up to 6” diameter, the sputter chamber base vacuum pressure is 5E-8 Torr, it can be used to sputter alloy film or multi layer film, especially it can be used to sputter very thin film for some typical materials base on the very low sputter pressure, this is the ideal tools for thin film R&D for the university and academy.

LOAD LOCK Chamber (option) Chamber with front open door Cryopump and dry pump Up to six magnetron sputter cathode DC, RF or pulse DC power supply Sputter up or down Max. 8” substrate Substrate rotation Substrate bias (option) Substrate heating to 1000C (option) Substrate cooling (option) Up to four channel process gas PID sputter pressure control Manual or automatic system control Good film uniformity and repeatability For sputter metal, semiconductor and insulation materials

DE600DL magnetron sputtering system is assembled with multi magnetron sputtering sources for deposition metals, semiconductor, insulation materials on the up to 6 inch substrate, it can be used to sputter multilayer thin film or co-sputter for alloy thin film. It is the ideal tools for thin film R&D for the university and academy

DE600C magnetron sputtering system is assembled with multi magnetron sputtering sources for deposition metals, semiconductor, insulation materials on the up to 6 inch substrate, it can be used to sputter multilayer thin film or co-sputter for alloy thin film. It is the ideal tools for thin film R&D for the university and academy