DE200 PLD Deposition System
Pulsed laser deposition (PLD) is a physical vapor deposition (PVD) technique where a high-power pulsed laser beam is focused inside a vacuum chamber to strike a target of the material that is to be deposited. This material is vaporized from the target (in a plasma plume) which deposits it as a thin film on a substrate (such as a silicon wafer facing the target). This process can occur in ultra high vacuum or in the presence of a background gas, such as oxygen which is commonly used when depositing oxides to fully oxygenate the deposited films.
Load Lock chamber
Substrate heating or cooling
- PLD UHV chamber
- STM UHV chamber
- UHV Sample manipulator
- Target stage manipulator
- Load Lock chamber
Typical PLD System Configuration and Variations
1. Typical PLD Configuration
The substrate and target are introduced through a load lock chamber opposite the target gearbox. The substrate is then rotated on its polar axis to face the target gearbox. The substrate can be moved out of the way for transfer of the targets. This is one of the most common and economical configurations.
Typical PLD configuration, vertically-mounted substrate manipulator
Typical PLD substrate manipulator with 2" quartz lamp heater
Typical PLD target manipulator, horizontal mount, STLC target system
2. Vertical PLD Configuration
This design features up-facing, gravity-held target holders to accommodate liquid, powder, or conventional targets. A custom transfer fork moves substrates and targets into place via standard load lock chamber.
3. Simple PLD Configuration
This design offers basic substrate and target devices with no XY or Z adjustment. Substrate and target changes are done at atmosphere.
4. Multi-Purpose PLD Configuration
This design permits MBE growth, via bottom-flange-mounted evaporation sources, as well as PLD growth. Substrate assembly faces the side of the chamber for PLD, the bottom for MBE, and the other side for in-vacuum transfer of substrates.
PLD substrate manipulator with 2" quartz lamp heater and gas shower ring.
We offers an extensive line of substrate and target manipulators as well as load lock and sample transfer systems for PLD systems. Our standard modular components can be configured in a variety of ways to meet your specific PLD system design. We can also design, integrate and certify complete PLD systems.
Typical Manipulator Specifications
Orientation Vertical or Horizontal X-Y movement ±0.5" or ±1.0" Substrate sample size<2" diameter Targets 6 - 1" (other configurations available) Sample orientation any Sample heating SHQ to 1292°F (water-cooled heater) Vacuum environment UHV, O2 In-vacuum sample transfer optional Base flange 8"
- Magnetron Sputtering System
- Electron Beam Evaporator
- Thermal Evaporation System
- Pulse Laser Deposition System
- Combination System
- Targets & materials